Ceramic Interconnect Technology Handbook (Record no. 3923)

MARC details
000 -LEADER
fixed length control field 02485 a2200385 4500
001 - CONTROL NUMBER
control field 1420018965
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250317111559.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 250312042018xx 385 eng
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781420018967
037 ## - SOURCE OF ACQUISITION
Source of stock number/acquisition Taylor & Francis
Terms of availability GBP 180.00
Form of issue BB
040 ## - CATALOGING SOURCE
Original cataloging agency 01
041 ## - LANGUAGE CODE
Language code of text/sound track or separate title eng
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Subject category code TEC008070
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Subject category code TEC021000
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Subject category code TEC007000
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Subject category code 621.381046
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100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Fred D. Barlow, III
245 10 - TITLE STATEMENT
Title Ceramic Interconnect Technology Handbook
250 ## - EDITION STATEMENT
Edition statement 1
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. CRC Press
Date of publication, distribution, etc. 20181003
300 ## - PHYSICAL DESCRIPTION
Extent 456 p
520 ## - SUMMARY, ETC.
Expansion of summary note Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.<br/><br/>Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.<br/><br/>Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Aicha Elshabini
Relationship B01

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